66-72

STRUCTURAL STABILIZATION OF ELEMENTS OF CERAMIC-AND-METAL PACKAGES AND BOARDS IN THE CONDITIONS OF CONTROLLED SINTERING HUMIDITY

N. M. Skulkin¹, O. N. Zholudova^2
1Volga State University of Technology,
3, Lenin Square, Yoshkar-Ola, 424000, Russian Federation
E-mail: SkulkinNM@volgatech.net
²Company iSpring,
110, Voznesenskaya St, Yoshkar-Ola, 424000, Russian Federation
E-mail: nancy.pong4@gmail.com

ABSTRACT

Introduction. The relevance of ongoing research in the sphere of the structural stability of conducting elements of ceramic-and-metal boards is that in the technology of these articles, compromise conditions of co-sintering of oxide substrates and metallic conductors are provided by the concentration of water vapors. On the whole the question of changing the sintering atmosphere, matched with performance criteria, with the structure of boards is open up to the present moment like the criteria themselves. First of all, it requires its experimental decision. The purpose of the work is to determine boundary values of metallized ceramics sintering atmosphere humidity, to analyze physical-chemical causes of reducing and ways of improving the quality of articles by means of the sintering atmosphere moisture degree optimization. Conditions, materials and methods. In this case sintering atmosphere humidity is considered as a factor of meeting requirements of the cooperative processing of oxide ceramics and the material of conductors by compromise. One of the additional demands of experimental research is the condition of the glassy state of the vitreous phase, because in this case the highest structural homogeneity and the reproducibility of metallization properties are observed. In this work as a material for metallization, the application of pastes on the basis of powder tungsten that is widely spread in the Russian technology of ceramic-and-metal packages and interconnection boards is considered. Conclusion. Sintering of articles with applied tungsten metallization in the conditions of changing sintering atmosphere humidity in the range of dew points from 20 °C to 35 °C is accompanied by the sublimation of tungsten oxides. The sublimation increases the through porosity of metallization which decreases its conductivity and the porosity of ceramic-and-metal seals. The limitation of sintering atmosphere humidity of ceramic-and-metal boards by the range of dew points from 20 °C to 25 °C provides tungsten metallization porosity preservation at the acceptable level and waste minimization according to criteria of solder joints strength, boards deformation criteria and the criteria of their appearance deterioration as a result of coloring. 

KEYWORDS

ceramics; interconnection boards; conducting elements; structure; technology; stabilization; quality parameters

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For citation: Skulkin N. M., Zholudova O. N. Structural Stabilization of Elements of Ceramic-and-Metal Pack-Ages and Boards in the Conditions of Controlled Sintering Humidity. Vestnik of Volga State University of Technology. Ser.: Radio Engineering and Infocommunication Systems. 2017. No 4 (36). Pp. 66-72. DOI: 10.15350/2306-2819.2017.4.66